Epolock2100 (PISHRO SAZEH PEYVAND BARSAVA)
two component
EPOLOCK 2100 is a two component, ambient temperature curing paste adhesive, which after post-curing either at application or in service, will give bonds with temperature resistance up to 100°C and good resistance to common chemicals. It is suitable for bonding a range of metals and polymeric substances such as GRE, GRP and SMC.